The CDFP connector has emerged as a game-changer in high-speed data center interconnects, offering an unprecedented blend of density, bandwidth and flexibility. Designed to meet the demands of modern hyperscale and cloud environments, CDFP supports up to 400 Gbps per port by aggregating 16 bi-directional lanes at 25 Gbps PAM-4 signaling. This capability aligns with current and next-generation PCIe Gen 5 and Gen 6 standards, ensuring seamless integration into existing architectures while laying the groundwork for future upgrades.Get more news about CDFP Connector,you can vist our website!
At its core, CDFP achieves high performance through an 85 Ω nominal impedance maintained across each lane, optimizing signal integrity and minimizing crosstalk. The connector footprint supports a full x16 link width in a single port and can be scaled down to x8 and x4 configurations when system requirements demand lower density. As the industry transitions from Gen 5 to Gen 6, the PCB connector options evolve from press-fit technology to surface-mount technology (SMT), delivering tighter tolerances and better mechanical reliability on high-speed boards.
Standardization has been critical to CDFP’s rapid adoption. Recognized by PCI-SIG as the external cabling form factor for PCIe Gen 5 and Gen 6, and defined under SNIA’s SFF-TA-1032 specification, CDFP connectors benefit from a robust ecosystem of multi-source components. Hyperscale cloud providers and OEMs have embraced the form factor, driving down costs through volume production and creating a wide portfolio of compatible cages, cable assemblies and host receptacles. This industry alignment simplifies system design and procurement for integrators seeking a future-proof I/O solution.
Mechanically, CDFP’s compact design packs 120 contacts for x16 configurations within a 0.75 mm pitch interface. Dual-row contact zones enable high-density signal routing, while the connector housing offers integrated EMI shielding to guard against external interference. Cable assemblies range from passive copper for short-reach applications to active copper and even optical solutions for longer links, giving system architects the flexibility to optimize trace lengths, routing, and thermal profiles without sacrificing performance.
In the era of disaggregated and composable infrastructure, CDFP plays a pivotal role. Data centers are moving toward pooled compute, memory and storage resources, connecting Just-a-Bunch-of-Memory (JBOM), Just-a-Bunch-of-GPUs (JBOG), Just-a-Bunch-of-Disks (JBOD), Just-a-Bunch-of-Flash (JBOF) and Just-a-Bunch-of-NICs (JBON) over high-speed fabrics. CDFP’s multi-lane aggregation and support for CXL fabrics enable low-latency, high-bandwidth links between accelerators, storage arrays and CPU head nodes. By abstracting physical device boundaries, operators can dynamically allocate resources and accelerate workloads like AI training, large-scale analytics and memory-centric computing.
Designers also benefit from CDFP’s thoughtful engineering around installation and serviceability. The cage assemblies incorporate keyed shells to prevent mis‐insertion, and offer multiple shell lengths to suit dense card-edge or over-board panel-mount configurations. Three distinct shell types ensure compatibility with direct attach copper, optical modules or hybrid cable solutions. On the PCB side, pre-loaded mating housings and co-packaged press-fit or SMT receptacles simplify assembly, reducing solder rework risk and speeding time‐to‐market.
Looking forward, CDFP is positioned to evolve alongside future PCIe and CXL standards. Its modular architecture already anticipates a migration path to PCIe Gen 7 signaling rates beyond 32 Gbps PAM-4, with optical and active electrical mediums poised to extend reach and lower power consumption. As data-driven applications proliferate, the ability to scale links without redesigning host boards or rewrite system firmware gives CDFP a lasting edge in the quest for higher throughput and greater composability.
In summary, the CDFP connector family represents a versatile, standardized and high-density I/O solution tailored for the data center’s next wave of disaggregated architectures. By delivering 400 Gbps per port, supporting press-fit and SMT options, and embracing a broad ecosystem of passive and active cable assemblies, CDFP empowers designers to build scalable, future-ready systems. Whether for hyperscale clouds, AI accelerator farms or pooled memory fabrics, CDFP stands at the forefront of high-speed interconnect technology, ready to meet the challenges of tomorrow’s data infrastructure.
